Silicone Potting Compounds

Zhaoshun’s RTV silicone potting compounds are liquid materials made from silicone. When in use, these products are potted into electronic components and circuit boards either manually or using machines. They are then cured to an elastomer at room temperature or through heating, and ensure the product’s heat dissipation, flame retardance, and waterproof performance.

Zhaoshun provides the following RTV silicone potting compounds for customers to choose from:

The following potting compound features an excellent viscosity, making it ideal for potting and encapsulating of LED lighting applications or sensitive electronic components. Note that volatile substances occur when curing, so we recommend this be used for thin-section potting applications.

These RTV silicone potting compounds are designed for potting and thermal protection of power modules and electronic components. In general, in order to improve the adhesion of the potting compound, we will use a primer, and as there are no byproducts generated during the curing process, there is no limitations to the potting thickness.

The two different product series below offer 3 potting compounds that cure to an adhesive silicone gel with a low internal stress, an excellent flexibility, and an outstanding shock resistance. With a high electrical insulation property, these products are used for protective potting of IGBT (insulated gate bipolar translator), sensors, delicate circuits, and hybrid circuits.

• Circuit board cleaning: use a solvent to remove any dust and soldering residue from the circuit board surface for a better adhesion effect.
• Localized protection treatment on parts requires no coating: simply apply the adhesive sticker film or anti-static adhesive tape for shading. The protected parts include the PCB plug, IC socket, trimming core, and more. Shading protection should be applied before cleaning to prevent the cleaner from entering these components.
• Dry: after cleaning and shading processes, the circuit board should be dried before coating. The drying temperature and time are determined by the maximum allowable temperature of the circuit board.