Non-Corrosive RTV Silicone Potting Compounds, ZS-GF-118

ZS-GF-118 RTV Silicone Potting Compounds

Non-Corrosive RTV Silicone Potting Compounds, ZS-GF-118
Description

The ZS-GF-118 RTV silicone encapsulates offer an outstanding adhesion to numerous substrates such as PC, ABS, aluminum, copper, stainless steel and PCB. When curing, it produces little micro molecules, which are non-corrosive to substrates. These silicone encapsulates feature a high transparency, outstanding electrical insulation, water resistance, yellowing resistance, and resistance to high and low temperatures, making them ideal for thin-section potting and conformal coating of electrical and electronic components and LEDs.

Typical applications

Potting and encapsulating of delicate electronic components, LED light bars, backlights and solar cells.

Technical specs
Performance index Component A Component B
Uncured properties Appearance Transparent liquid Clear liquid
Viscosity (cps) 1200-1800 10-30
Mix ratio/A:B by weight 10∶1
Mixing viscosity (cps) 1000-1400
Working time (min) 30～60
Cure time (h) 3-5
Cured properties Hardness (Shore A) 12-18
Specific gravity 0.95~1.00
Dielectric Strength (kV/mm) ≥18
Dielectric constant (1.2MHz) 3.0～3.3
Volume resistivity (Ω·cm) ≥1.0×1014
Service temperature range (℃) -60～200
Note:
  • The above technical specs are measured at a room temperature of 25℃ and 55% RH.
  • Mechanical and electrical properties are tested after the products are fully cured.
  • The above data is provided for reference only and is subject to the measured data by customers.
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