Thermally Conductive Cure-in-Place Potting Compounds, ZS-GF-5299Z-30

ZS-GF-5299Z-30 RTV Silicone Potting Compounds

Thermally Conductive Cure-in-Place Potting Compounds, ZS-GF-5299Z-30
Description

The ZS-GF-5299Z-30 is a medium viscosity, two-part, heat curing, high thermally conductive sealant. The higher the temperature, the faster it cures. No byproduct occurs during curing, making this potting compound applicable to substrates including plastics and metals like PC(Poly-carbonate), PP, ABS, PVC and more. Temperature range of -40℃ to 200℃ and fully meets EU RoHS and REACH standards.

Typical applications

Potting, encapsulating and thermal protection of power modules and other electron components

Technical specs
Performance index Component A Component B
Uncured properties Appearance Light red liquid Offwhite liquid
Viscosity (cps) 12000～18000 12000～18000
Mix ratio/A:B by weight 1∶1
Mixing viscosity (cps) 12000-18000
Working time at room temperature (min) 60-90
Cure time at room temperature (h) 4-6
Cured properties Hardness (Shore A) 50-60
Thermal conductivity[W/m.K] ≥3.0
Dielectric Strength (kV/mm) ≥13
Dielectric constant (1.0MHz) 2.8-3.3
Volume resistivity (Ω·cm) ≥1.0×1013
Specific gravity (g/cm3) 3.0±0.1
Note:
  • The above uncured properties are measured at room temperature where the product is produced.
  • Mechanical and electrical properties are tested after the products are fully cured.
  • Zhaoshun cannot assume responsibility for different results obtained under different conditions or caused by product improvement.
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