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- Thermally Conductive Potting Compounds, ZS-GF-5299Z-3
The ZS-GF-5299Z-3 RTV silicone potting compounds is a medium viscosity, two-component, high thermal conductivity silicone sealant. It cures via heating and cures faster with a higher temperature. This product releases no byproduct when curing, making it applicable to substrates that include metals and plastics such as PC(Poly-carbonate), PP, ABS, PVC, and more. Temperature range of -60℃ to 220℃. And fully meets EU RoHS and REACH standards.
Potting, encapsulating and thermal protection of power modules and other electronic components
Performance index | Component A | Component B | ||
Uncured properties | Appearance | Gray liquid | White liquid | |
Viscosity (cps) | 4000~6000 | 4000~6000 | ||
Mix ratio/A:B by weight | 1∶1 | |||
Mixing viscosity (cps) | 4000~6000 | |||
Working time at room temperature (min) | 50-70 | |||
Cure time at room temperature T (h) | T+5℃: 2-4 | |||
T: 4-6 | ||||
T-5℃: 6-12 | ||||
Cured properties | Hardness (Shore A) | 40-50 | ||
Thermal conductivity[W/m.K] | ≥0.9 | |||
Dielectric Strength (kV/mm) | ≥13 | |||
Dielectric constant (1.0MHz) | 2.6-3.2 | |||
Volume resistivity (Ω·cm) | ≥1.0×1012 | |||
Specific gravity (g/cm3) | 1.95±0.05 |
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